| PART |
Description |
Maker |
| STV0498 |
DOCSIS 2.0 cable modem chip with channel bonding
|
STMicroelectronics
|
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| PG160128-A |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp.
POWERTIP[Powertip Technology]
|
| MMM-A-134 |
Metal to Metal Structural Bonding
|
ETC
|
| MPC555 MPC555LFMZP40 MPC555PB MPC555D MPC555LFAZP4 |
This document provides an overview of the MPC555 microcontroller, including a block diagram showing the major modular components and sections that lis
THIS DOCUMENT PROVIDES AN OVERVIEW OF THE MPC555 MICROCONTROLLER, INCLUDING A BLOCK DIAGRAM SHOWING THE MAJOR MODULAR COMPONENTS AND SECTIONS THAT LIS
This document provides an overview of the MPC555 microcontroller, including a block diagram showing
Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-98
CABLE ASSEMBLY; ; NMO Antenna Mount to BNC Male, RG58C/U, 5 feet
|
MOTOROLA[Motorola, Inc]
Motorola, Inc.
|
| T-759 |
SCHEMATIC DIAGRAM
|
Rhombus Industries Inc.
|
| CX6840 CX6837 CX-6837 CX-6840 |
SCHEMATIC DIAGRAM 原理
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| STK403-070 STK-403-070 |
AMP SCHEMATIC DIAGRAM
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| MPC8260 |
UPM Timing Diagram
|
Freescale Semiconductor, Inc
|
| AM386DX |
Am386DX Block Diagram
|
Advanced Micro Devices
|
