| PART |
Description |
Maker |
| WEDPS512K32-12BC WEDPS512K32-12BI WEDPS512K32-12BM |
512Kx32 SRAM MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| WS512K32BV WS512K32BV-XXXE WS512K32NBV-15H2IEA WS5 |
512Kx32 3.3V SRAM Module(512Kx32, 3.3V,静态RAM模块（BiCOMS,存取时间20ns
512Kx32 3.3V SRAM Module(512Kx32, 3.3V,静态RAM模块（BiCOMS,存取时间17ns
GIGATRUE 550 CAT PATCH CABLE NO BOOT 15FT GREEN
GIGATRUE 550 CAT PATCH CABLE NO BOOT 20FT GREEN
GIGATRUE 550 CAT PATCH CBL NO BOOT 15FT GR 25 PK
512Kx32 3.3V SRAM MODULE 512Kx32 3.3V的静态存储器模块
|
White Microelectronics
http://
List of Unclassifed Manufacturers
White Electronic Designs Corporation
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| WED2DL32512V38BC WED2DL32512V40BI WED2DL32512V40BC |
512Kx32 Synchronous Pipeline Burst SRAM
|
WEDC[White Electronic Designs Corporation]
|
| WSF41632-22H2C WSF41632-22H2M WSF41632-22H2MA WSF4 |
128KX32 SRAM & 512Kx32 FLASH MIXED MODULE
|
White Electronic Designs Co...
|
| PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-02 |
15NS, 68 PLCC, IND TEMP(EPLD)
SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
15NS, 68 PLCC, COM TEMP(EPLD)
SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC
20NS, 44 PLCC, IND TEMP(EPLD)
30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA)
15NS, TQFP, COM TEMP, ROHS-A(EPLD)
20NS, 44 TQFP, COM TEMP(EPLD)
7NS, 44 TQFP, COM TEMP, GREEN(EPLD)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 静态存储器| 512KX32 |的CMOS |美巡赛| 66PIN |陶瓷
|
Intel, Corp.
|
| W82MV-NSBM W82M32V-XBX W82MV-NSBC W82MV-NSBI |
2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| TH50VSF3580AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
| AM50DL128BG70I AM50DL128BG85I AM50DLI28BG |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
