| PART |
Description |
Maker |
| TEA2015ASP TEA2015A |
Vertical Sweep for Black and White and 60 Color TV Sets
VERTICAL SWEEP FOR BLACK AND WHITE AND 90 COLOR TV SETS
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| 0908160322 90816-0322 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 22 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 22 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0901301128 90130-1128 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| 90130-1254 0901301254 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1230 0901301230 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1212 0901301212 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1222 0901301222 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1234 0901301234 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1226 0901301226 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 34695-0100 |
Stac64?Single Bay Vertical Power Header, 10 Circuits, Polarization A, Black, Tray
|
Molex Electronics Ltd.
|
| 0780790011 78079-0011 |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 90816-3304 0908163304 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Gold (Au) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 4 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
|
