| PART |
Description |
Maker |
| KBC1100-RT KBC1100 KBC1100-RD |
MOBILE KBC WITH SUPER I/O, SFI, ADC AND DAC WITH SMSC SENTINELALERT
|
SMSC[SMSC Corporation]
|
| BCM8727BIFBG |
DUAL-CHANNEL 10-GBE SFI-TO-XAUI TRANSCEIVER WITH EDC
|
Broadcom Corporation.
|
| UPC2745 UPC2745TB UPC2745TB-E3 UPC2746TB UPC2746TB |
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC[NEC]
|
| UPC2745TB UPC2746TB-E3 |
3 V/ SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC Corp.
|
| UPC2771TB UPC2771TB-E3 UPC2762TB UPC2762TB-E3 UPC2 |
3 V SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC[NEC]
|
| MF1117V-2 |
From old datasheet system
FOR DIGITAL MOBILE TELEPHONE Rx
FOR DIGITAL MOBILE TELEPHONE, Rx
FOR DIGITAL MOBILE TELEPHONE / Rx
GIGATRUE 550 CAT6 PINK STRANDED BULK 250FT
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
|
| MOC |
Applications: Wired Network, Automotive, Mobile Communication, WiMAX, WLAN, Mobile
|
MERITEK ELECTRONICS COR...
|
| HYB18L256160B |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM DRAM的针对移动应56兆移动RAM
|
Qimonda AG
|
| HYB18M512160BFX HYB18M512160BFX-7.5 |
DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM
|
Qimonda AG
|
| HYE18L256160BFX-7.5 HYE18L256160BCX-7.5 HYB18L2561 |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM
|
Qimonda AG
|
| RG82845M 82845MZ 82845MP 82845MX |
Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)
|
Intel Corporation
|
