| PART |
Description |
Maker |
| IBM11N4845BB IBM11N4845CB |
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 带纠错代码保护的小外形双列直插动态RAM模块) 4米72片，杀死保护ECC的上内存模块米72带纠错代码保护的小外形双列直插动态内存模块）
4M x 72 Chip-Kill Protect ECC-on-DIMM Module(4M x 72 甯????唬????ょ?灏??褰㈠?????????AM妯″?)
|
International Business Machines, Corp.
IBM Microeletronics
|
| STA8058 |
Teseo high performance GPS multi chip module (MCM)
Teseo⑩ high performance GPS multi chip module (MCM)
|
STMicroelectronics
|
| MC-7884 MC-7884-15 |
GaAs MULTI-CHIP MODULE
|
NEC
Quanzhou Jinmei Electro...
|
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| V048F040T050 V048F040M050 |
VI Chip - VTM Voltage Transformation Module
|
VICOR[Vicor Corporation]
|
| B048K030T21 B048K030M21 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
| B048L120T10 B048F120T10 B048G120T10 B048K120T10 |
VI Chip - BCM Bus Converter Module
|
VICOR[Vicor Corporation]
|
| VS6624 |
1.3 Megapixel single-chip camera module
|
STMicroelectronics
|
