| PART |
Description |
Maker |
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| Z8400AB1 Z8400AB6 Z8400AC1 Z8400AC6 Z8400AD1 Z8400 |
Z80 CPU central processor unit, 6.0 MHz, ceramic chip-carrier package
Z80 CPU Central Process Unit
Z80 CPU central processor unit, 8.0 MHz, ceramic chip-carrier package
|
意法半导
STMICROELECTRONICS[STMicroelectronics]
SGS Thomson Microelectronics
|
| CA-QFE32SA-L-Z-T-02 |
Carrier Adaptor (CA); 32 position QFP ZIF socket (mini-grid on .040 centers) to 32 position QFP surface-mountable leadless foot with test points.
|
Ironwood Electronics.
|
| PMEG3002AEL |
30 V, 0.2 A very low Vf MEGA Schottky barrier rectifier in leadless ultra small SOD 882 package
30 V, 0.2 A very low VF MEGA Schottky barrier rectifier in leadless ultra small SOD882 package
|
PHILIPS[Philips Semiconductors]
|
| PMEG3002AEL |
30 V, 0.2 A very low V_F MEGA Schottky barrier rectifier in leadless ultra small SOD882 package 无铅超小型SOD882封装0伏，0.2安很低正向压降MEGA肖特基势垒整流器
30 V, 0.2 A very low VF MEGA Schottky barrier rectifier in leadless ultra small SOD882 package
|
NXP Semiconductors N.V.
http://
|
| NTLMS4507N |
Power MOSFET 30 V, 24 A, N-Channel, SO-8 Leadless Package
|
ON Semiconductor
|
| SSC-UR201 |
Surface-mounted and leadless chip LED device
|
http://
|
| GM1ZSG80300A |
Super Luminosity Dichromatic Leadless Chip LED
|
Sharp
|
| LT1H40A LT1K40A LT1U40A LT1D40A LT1E40A LT1P40A LT |
2125 Size, 0.8mm Thickness, Leadless Chip LED Devices
|
List of Unclassifed Manufacturers
SHARP[Sharp Electrionic Components]
ETC[ETC]
N.A.
|
| ATF-551M4 |
Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package
|
Agilent(Hewlett-Packard)
|
