| PART |
Description |
Maker |
| 21-0146 21-0146A |
PACKAGE OUTLINE 52L TQFP 10x10x1.0 MM
|
MAXIM - Dallas Semiconductor
|
| 48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| STL3NK40 |
N-channel 400 V, 4.5 Ohm typ., 0.43 A SuperMESH(TM) Power MOSFET in a PowerFLAT 5x5 package
|
ST Microelectronics
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
| WLCSP11X12-132 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
