| PART |
Description |
Maker |
| 21-0181 |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
|
Maxim Integrated Products
|
| 21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm 封装外形12,16蜇薄QFN3x3x0.8mm
|
Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| PL00130-WCG10-14 |
SMD LED 0603 Package Top View
Flat lens thin package 1.6 x 0.8 x 0.8mm
|
P-tec Corporation
|
| PL00130-WCA03-14 |
SMD LED 0603 Package Top View
Flat lens thin package 1.6 x 0.8 x 0.8mm
|
P-tec Corporation
|
| PL00130-WCG25-14 |
SMD LED 0603 Package Top View
Flat lens thin package 1.6 x 0.8 x 0.8mm
|
P-tec Corporation
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| SSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-4 |
Package Outline
|
Global Mixed-mode Techn...
|
