PART |
Description |
Maker |
AM49DL3208G |
Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM
|
Advanced Micro Devices
|
DS42515 AM29DL164D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM41PDS3228D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM42BDS6408G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
AM45DL3208G AM45DL3208GT85IT AM45DL3208GT85IS AM45 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGE13VW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
AM70PDL127CDH66IT AM70PDL127CDH85IS AM70PDL127CDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装(MCP / XIP)的快闪记忆体,数据存储的MirrorBit闪存和移动存储芯片(XIP)的 Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) SPECIALTY MEMORY CIRCUIT, PBGA93 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位)的CMOS 3.0伏特,只有页面模式闪存数据存28兆位米16位)的CMOS
|
Spansion Inc. Spansion, Inc.
|
DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC ADVANCED MICRO DEVICES INC
|
AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|