| PART |
Description |
Maker |
| F12396-11 |
COMPACT MCP ASSEMBLY SERIES
|
Hamamatsu Corporation
|
| F4655-01 |
WIDE DYNAMIC RANGE MCP ASSEMBLY FOR HELIUM LEAK DETECTOR
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| SSCDA10008 |
CENTER TAP/DOUBLER ASSEMBLY
|
Sensitron
|
| B65806K1004D002 B65806K1006D002 B65539C1002X101 B6 |
Core without center hole for transformer applications
|
EPCOS[EPCOS]
|
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| 5390170-6 |
SOCKET ASSEMBLY, 168 POSITION, CENTER PLASTIC POST 2.60[.103] SOLDERTAIL, LOW PROFILE DIMM 2P
|
Tyco Electronics
|
| 0878311820 87831-1820 |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Vertical, Through Hole, Shrouded, Lead-free 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Center Polarization Slot
|
Molex Electronics Ltd.
|
| S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc.
SPANSION LLC
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
