| PART |
Description |
Maker |
| M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4655-01 |
WIDE DYNAMIC RANGE MCP ASSEMBLY FOR HELIUM LEAK DETECTOR
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| S71WS512NB0BAEZZ0 S71WS512NB0BAEZZ2 S71WS512N80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt 堆叠式多芯片产品（MCP）的闪存和移动存储芯片的CMOS 1.8伏特
|
Spansion Inc.
Spansion, Inc.
|
| S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品
Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc.
Spansion, Inc.
|
| DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| S2HVS7.5 S2HVS2.5 S2HVS5 |
High Voltage,High Density, Standard Recovery Rectifier Assembly(反向电压7500V，高压，高密度，标准恢复整流器部
STANDARD RECOVERY HIGH VOLTAGE RECTIFIER ASSEMBLY
|
Semtech Corporation
|
| AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73
Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装（MCP）闪存和SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc.
Advanced Micro Devices
|
| S4KW12KA-3 S4KW4KA-1 S4KW24KA-6 S4KW8KA-2 |
High Voltage,High Current,Standard Recovery Rectifier Assembly(反向电压12000V，高压，大电流，标准恢复整流器部 高电压，大电流，标准恢复整流大会（反向电2000V，高压，大电流，标准恢复整流器部件）
High Voltage,High Current,Standard Recovery Rectifier Assembly(反向电压8000V，高压，大电流，标准恢复整流器部
STANDARD RECOVERY HIGH VOLTAGE, HIGH CURRENT RECTIFIER
|
Semtech Corporation
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| AM70PDL127BDH66IS AM70PDL127BDH66IT AM70PDL127BDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion, Inc.
Spansion Inc.
|
