| PART |
Description |
Maker |
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CTLL1608-FH10NJ CTLL1608-FH10NK CTLL1608-FH12NJ CT |
1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors - Ceramic
1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.062 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Central Technologies / CT Magnetics
|
| DPS128X16BA3-25C DPS128X16BA3-45M DPS128X16BH3-45I |
128K X 16 MULTI DEVICE SRAM MODULE, 25 ns, PGA50 CERAMIC, MODULE, SLCC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 45 ns, PGA50 CERAMIC, MODULE, SLCC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 45 ns, QFP48 GULLWING, STACK, SLCC-48
128K X 16 MULTI DEVICE SRAM MODULE, 20 ns, PGA50 CERAMIC, MODULE, SLCC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 20 ns, QFP48 GULLWING, STACK, SLCC-48
128K X 16 MULTI DEVICE SRAM MODULE, 35 ns, PGA50 CERAMIC, MODULE, SLCC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 35 ns, QFP48 GULLWING, STACK, SLCC-48
|
Twilight Technology, Inc.
|
| MCH022A4R7DK MCH02 MCH022A010CK MCH022A020CK MCH02 |
Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
| MCH032A1R5CK MCH038FN103ZK MCH03 MCH032A010CK MCH0 |
Multi-layer ceramic chip capacitors
|
ROHM[Rohm]
|
| MM196 |
6 MOSFET Multi-Chip Module
|
Microsemi Corporation
|
| STA8058 |
GPS multi-chip module
|
ST Microelectronics
|
| CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
|
