| PART |
Description |
Maker |
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| LTV847M-V LTV847-V LTV847S-V LTV-817 LTV817-V LTV8 |
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC845 |
High Sensitivity, High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| ISP815 ISP815X ISP825 ISP845 ISP845X ISP825X |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM[ISOCOM COMPONENTS]
|
| TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
| TIL199A |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
N.A.
|
| TIL198 TIL198A TIL198B TIL197B TIL1B98A TIL1B98B T |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ETC[ETC]
|
