| PART |
Description |
Maker |
| FCRN303 FCRN3031003FA |
Percision thin film resistor CSP
0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|
| NCP629FC28T2G NCP629FC18T2G NCP629FC15T2G NCP629FC |
High Performance CMOS LDO Regulator with Enable and Enhanced ESD Protection in Chip Scale Package (CSP)
|
ON Semiconductor
|
| M6MGE13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM17AWG-P M6MGT64BM17AWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM34CWG M6MGT64BM34CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
|
Renesas Electronics Corporation
|
| PACDN2404CR PACDN2404C PACDN2416CR PACDN2408C PACD |
ESD PROTECTION ARRAYS CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
|
California Micro Devices Corporation
CALMIRCO[California Micro Devices Corp]
|
| FCSP230LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP07H40TR |
Chip Scale Package Schottky Barrier Rectifier, 0.75 A
|
Vishay Siliconix
|
