| PART |
Description |
Maker |
| C3216X7S2A225MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| 2450BL15K050 |
2.45 GHz Medium Performance Balun (Compatible with TDK)
|
Johanson Technology Inc.
|
| 44A0212 |
This specification sheet forms a part of the latest issue of Raychem Specification 44 and MIL-W-81044 as applicable.
|
Tyco Electronics
|
| 55PC6021 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0114 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC7000 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| ATMEGA16M1 ATMEGA16M1AUTO ATMEGA32C1 ATMEGA64M1 |
Automotive Specification at 150掳C
Automotive Specification at 150°C
|
ATMEL Corporation
|
| PXA255 GDPXA255A0E400 LUPXA255A0E400 LUPXA255A0C20 |
Electrical, Mechanical, and Thermal Specification
Intel? PXA255 Processor Electrical, Mechanical, and Thermal Specification
|
Intel Corporation
|
| MPC8240RZUPND MPC8240RZUPNS |
MPC8240 Part Number Specification for the XPC8240RZUnnnx Series
Part Number Specification for the XPC8240RZUnnnx Series
|
Motorola
|
