PART |
Description |
Maker |
RFP-1962-32-27 |
HPA Module
|
RFHIC
|
RFP-0895-27-27PS |
HPA Module
|
RFHIC
|
TGA2508-EPU |
Ku Band HPA
|
TriQuint Semiconductor
|
TGA4505 TGA4505-15 |
4 Watt Ka Band HPA
|
TriQuint Semiconductor, Inc.
|
TGA2509 |
Wideband 1W HPA with AGC
|
TriQuint Semiconductor, Inc.
|
TGA4501-SCC |
24-31 GHz Ka Band HPA
|
TriQuint Semiconductor
|
TGA2503-EPU |
Ku Band HPA 13 - 17 GHz 2 Watt, 32dB Power Amplifier
|
TriQuint Semiconductor
|
LPS25HB |
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer
|
STMicroelectronics
|
HDPM01 |
HDPM01 module includes a pressure module and a compass module
|
Hope Microelectronics co., Ltd
|
HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered 8M x 72-Bit Dynamic RAM Module (ECC - Module) 8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块 8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168 Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group] Infineon SIEMENS AG
|