| PART |
Description |
Maker |
| DSPIC33EP512GM710 |
dsPIC33EP512GM710 100-Pin TQFP to 100-Pin Plug-In Module (PIM) Information Sheet
|
Microchip Technology
|
| SEAL100FP |
Sealed Conversion Board for Converting from 100-pin 0.65mm-pitch QFP (100P6S-A) or LCC (100D0) to 100-pin Standard Pitch
|
Renesas Electronics Corporation
|
| PIC18F66J60 PIC18F66J65 PIC18F97J60T PIC18F67J60 P |
64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet
|
MICROCHIP[Microchip Technology]
|
| PIC18F66J65-I_PF PIC18F86J65-I_PF PIC18F96J65-I_PF |
64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet
|
Microchip Technology
|
| 50PT1051AXLF |
50 PIN DIP ETHERNET 10/100 BASE-TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
| 40PT1041AX |
40 PIN DIP ETHERNET 10/100 BASE -TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
| 40SS1041AXMLF |
40 PIN SMD ETHERNET 10/100 BASE -TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
| 40PT1140AXLF |
40 PIN DIP ETHERNET 10/100 BASE -TX HIGH SPEED LAN MAGNETICS
|
Bothhand USA, LP.
|
| 74980-2504 |
2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Pin End Version, 100 Circuits, Pin Length 5.15mm (.203)
|
Molex Electronics Ltd.
|
| 0010894266 10-89-4266 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle, 26 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Selec
2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle, 26 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| HVB14S |
TIP REPLACEMNT TEFLON FOR DP-100
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator
|
Hitachi,Ltd.
HITACHI[Hitachi Semiconductor]
|
