PART |
Description |
Maker |
CMPT5401E |
ENHANCED SPECIFICATION SURFACE MOUNT PNP SILICON TRANSISTOR
|
CENTRAL[Central Semiconductor Corp]
|
CXT5551E |
ENHANCED SPECIFICATION SURFACE MOUNT NPN SILICON TRANSISTOR
|
CENTRAL[Central Semiconductor Corp]
|
CMST6427E10 |
ENHANCED SPECIFICATION SURFACE MOUNT NPN SILICON DARLINGTON TRANSISTOR
|
Central Semiconductor Corp Central Semiconductor C...
|
SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
CMPD2838E CMPD2836E |
SMD Switching Diode Dual: Common Anode ENHANCED SPECIFICATION SURFACE MOUNT DUAL, SILICON SWITCHING DIODES
|
CENTRAL[Central Semiconductor Corp]
|
CMPTA42E CMPTA92E |
SMD Small Signal Transistor PNP High Voltage ENHANCED SPECIFICATION SURFACE MOUNT COMPLEMENTARY HIGH VOLTAGE SILICON TRANSISTORS
|
CENTRAL[Central Semiconductor Corp]
|
SPQ0410HE5H-PB |
Slim UltraMini SiSonicTM Microphone Specification With Enhanced RF Protection-Halogen Free
|
Knowles Electronics
|
LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
|
MICROSEMI CORP-LOWELL Microsemi, Corp. MICROSEMI[Microsemi Corporation]
|
749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning specification for release specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany. Wurth Elektronik GmbH &...
|