| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5SMX12M3300 |
IGBT-Die
|
ABB Semiconductors
The ABB Group
|
| 5SMX12K1701 |
IGBT-Die
N/A
|
The ABB Group
ABB Semiconductors
|
| 5SMX12E1273 |
IGBT-Die
|
The ABB Group
|
| IRG4CC50KB |
IRG4CC50KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH50UB |
IRG4CH50UB IGBT Die in Wafer Form
|
Fairchild Semiconductor, Corp.
International Rectifier
|
| IRG4CH30KB |
IRG4CH30KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC81UB |
IRG4CC81UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC40FB |
IRG4CC40FB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10KB |
IRG4CC10KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30KB |
IRG4CC30KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10SB |
IRG4CC10SB IGBT Die in Wafer Form
|
International Rectifier
|
