| PART |
Description |
Maker |
| PL-VD0-00-SG0-C0 |
850 nm 4.25 G VCSEL Die
|
JDS Uniphase Corporation
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 68-304538-10 68-304538-10-P |
PLCC68-PGA68, IC SOCKET
68-Pin PLCC w/Die Flipped-to-68-Pin PGA for 87C196 IC and Others
|
ARIES ELECTRONICS INC
Aries Electronics, Inc.
|
| JCPS-8-850-75 |
10 MHz - 850 MHz RF/MICROWAVE COMBINER, 3 dB INSERTION LOSS ROHS COMPLIANT, METAL, CASE BG291, 14 PIN
10 MHz - 850 MHz RF/MICROWAVE COMBINER, 3 dB INSERTION LOSS CASE BG291, 14 PIN
|
Mini-Circuits
|
| HMMC-5040 |
MICROWAVE/MILLIMETER WAVE AMPLIFIER,GAAS,DIE
From old datasheet system
|
Agilent Technologies
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| HMPP-3892 |
50 V, SILICON, PIN DIODE DIE-4
|
Agilent Technologies, Inc.
|
| HYS72T512022EP HYS72T512022EP-3.7-B HYS72T512022EP |
240-Pin Dual Die Registered DDR2 SDRAM Modules
|
Qimonda AG
|
| HYS72T1G242EP-3.7-C |
240-Pin Dual Die Registered DDR2 SDRAM Modules 1G X 72 DDR DRAM MODULE, 0.7 ns, DMA240
|
Qimonda AG
|
| MASW-011036-001SMB MASW-011036-14130G MASW-011036- |
Ka-Band High Power Terminated SPDT PIN Switch
Die with G-S-G RF Pads and DC Bias Pads
|
M/A-COM Technology Solu...
|
