| PART |
Description |
Maker |
| ROCHESTER5 |
A Rochester Electronics White Paper
|
Rochester Electronics
|
| MP3-X2PCM100.001/20/250VACREEL16.5/360 MP3-X2PCM10 |
CAPACITOR, METALLIZED PAPER, 0.001 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0047 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0015 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.047 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.015 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.0033 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 1 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, METALLIZED PAPER, 0.1 uF, THROUGH HOLE MOUNT RADIAL LEADED
|
Yageo, Corp.
|
| GRM1555C1H180JA01D GRM1555C1H180JA01W GRM1555C1H18 |
180mm Paper taping 10000 330mm Paper taping 50000
|
Murata Manufacturing Co., Ltd.
|
| SMDMP3-Y23300/20/250BP330 SMDMP3-Y24700/20/250BP33 |
CAPACITOR, METALLIZED PAPER, 0.0033 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, METALLIZED PAPER, 0.0047 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, METALLIZED PAPER, 0.0015 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, METALLIZED PAPER, 0.0022 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, METALLIZED PAPER, 0.001 uF, SURFACE MOUNT, 6560 CHIP
|
Cosmo Electronics
Ecliptek, Corp.
|
| M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 |
EE PLD, 10 ns, PBGA352 BGA-352
EE PLD, 12 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160
EE PLD, 15 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144
EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160
CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100
EE PLD, 15 ns, PQFP100 TQFP-100
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208
EE PLD, 12 ns, PQFP100 TQFP-100
EE PLD, 12 ns, PBGA256 BGA-256
|
Lattice Semiconductor, Corp.
LATTICE SEMICONDUCTOR CORP
|
| MP3-X2PCM22.50.1/20/275VACREEL18.5/500 MP3-X2PCM22 |
CAPACITOR, METALLIZED PAPER, 0.1 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, METALLIZED PAPER, 0.047 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, METALLIZED PAPER, 1 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, METALLIZED PAPER, 0.001 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, METALLIZED PAPER, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
|
Rhombus Industries, Inc.
Electronic Theatre Controls, Inc.
|
| CAT64LC40ZJ CAT64LC40ZS CAT64LC40J-TE7 CAT64LC40J- |
72-Mbit QDR™-II SRAM 2-Word Burst Architecture
72-Mbit QDR™-II SRAM 4-Word Burst Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture
SPI Serial EEPROM SPI串行EEPROM
72-Mbit QDR-II™ SRAM 2-Word Burst Architecture SPI串行EEPROM
72-Mbit QDR™-II SRAM 2-Word Burst Architecture
|
Analog Devices, Inc.
|
| CRCW080593K1FKTA CRCW0805931RFKTA CRCW-0805-7R87-F |
Res Thick Film 0805 93.1K Ohm 1% 1/8W ±100ppm/C Molded SMD Paper T/R
Res Thick Film 0805 931 Ohm 1% 1/8W ±100ppm/C Molded SMD Paper T/R
D../CRCW....-P Thick Film, Rectangular, Precision Resistors
Cap Ceramic 47pF 100V U2J 2% (5.5 X 3.5mm) Radial 5mm 125C Bulk
D 100V 18PF 2% C0G AMMO E3 - Ammo Pack
Cap Ceramic 470pF 100V P3K 2% (11 X 4mm) Radial 5mm 125C Bulk
D 50V 470PF 5% SL BULK E3 - Bulk
Film/Foil Resistor, RESISTOR, METAL GLAZE/THICK FILM, 0.1 W, 5 %, 200 ppm, 91 ohm, SURFACE MOUNT, 0805, CHIP
Res Thick Film 1210 100 Ohm 1% 1/2W ±100ppm/C Molded SMD Paper T/R
1210,100,5%,T/R - Tape and Reel
Res Thick Film 1210 75 Ohm 1% 1/2W ±100ppm/C Molded SMD Paper T/R
MO-002AG7 NZFD
D 500V 150PF 5% SL0 BULK E3 - Bulk
D 500V 330PF 5% SL0 REEL E3 - Tape and Reel
Res Thick Film 2512 150 Ohm 1% 1W ±100ppm/C Molded SMD Blister T/R
Res Thick Film 0603 62K Ohm 1% 1/10W ±100ppm/C Molded SMD Paper T/R
0603,62M,5%,T/R - Tape and Reel
Res Thick Film 0603 562K Ohm 1% 1/10W ±100ppm/C Molded SMD Paper T/R
Res Thick Film 0603 560 Ohm 1% 1/10W ±100ppm/C Molded SMD Paper T/R
Film/Foil Resistor, RESISTOR, METAL GLAZE/THICK FILM, 0.0625 W, 5 %, 200 ppm, 56 ohm, SURFACE MOUNT, 0603, CHIP
Res Thick Film 1206 16K Ohm 1% 1/4W ±100ppm/C Molded SMD Paper T/R
D 500V 3,3NF -20/ 80% Y5V AMMO E3 - Ammo Pack
D 500V 8,2PF 0,25PF C0H BULK E3 - Bulk
D 500V 6,8PF 0,25PF C0H BULK E3 - Bulk
Res Thick Film 0402 2.47 Ohm 5% 1/16W ±400ppm/C Molded SMD Paper T/R
Res Thick Film 0805 240 Ohm 1% 1/8W ±100ppm/C Molded SMD Paper T/R
Cap Ceramic 15pF 100V C0G 2% (5 X 3.5mm) Radial 5mm 125C Bulk
Res Thick Film 0805 301K Ohm 1% 1/8W ±100ppm/C Molded SMD Paper T/R
|
Vishay Dale
|
| KPS1002C |
Paper Sensor
|
KODENSHI KOREA CORP.
|
| CY7C1515KV18-250BZXI CY7C1515KV18-300BZC CY7C1515K |
72-Mbit QDR II SRAM 4-Word Burst Architecture
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 QDR SRAM, 0.45 ns, PBGA165
|
http://
Cypress Semiconductor, Corp.
|
| JN1-22-20S-R-10000 JN1-22-22S-10000 JN1-22-26S-100 |
MAGAZINE PAPER TYPE
|
Japan Aviation Electronics Industry, Ltd.
|
| SSP-132MHT SSP-122BHT SSP-122RVT |
H=1mm Paper Slide Switches
|
MITSUMI ELECTRIC
MITSUMI[Mitsumi Electronics, Corp.]
|
|
