| PART |
Description |
Maker |
| 16188 16188-7 |
THERMAL INTERFACE PAD, (MAXI) 热接口垫，（马西
THERMAL INTERFACE PAD (MAXI)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| PC93-20-5-2 |
Non-Silicone Thermal Conductive Pad
|
List of Unclassifed Man...
|
| TMP-001 TMP-002 TMP-003 TMP-005 TMP-007 |
TMP Thermal Pad Accessory
|
http://
Crane Aerospace & Electronics.
|
| FDMF5822DCCT-ND |
FDMF5822DC-Smart Power Stage (SPS) Module with Integrated Thermal Warning and Thermal Shutdown
|
Fairchild Semiconductor
|
| B12A12005L310100U253 |
Thermal motor protector Temperature limiter Thermal cut-out
|
List of Unclassifed Manufacturers
ETC
|
| NF3004-WA30A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| SE3003-DC70A |
High speed thermal printhead (with thermal historical control)
|
Rohm
|
| SE2002-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
| KF3003-GL50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GL Series
Thick Film Thermal Printhead (300DPI)
|
Rohm CO.,LTD.
|
| KF2004-GL50A |
Thick film thermal printhead (8 dots / mm)
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GL Series
|
Rohm CO.,LTD.
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
