PART |
Description |
Maker |
M6MGE13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
M6MGB64BM17AWG M6MGT64BM17AWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
SFC05-4 SFC05-4TM |
CSP TVS Flip Chip TVS Diode Array CSP TVS Flip Chip TVS Diode Array 总警司二极管倒装芯片抑制二极管阵
|
SEMTECH[Semtech Corporation] Semtech, Corp.
|
NP383-28804-N NP383-28804-P NP383-84107-N NP383-84 |
Chip Scale Package -TH (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
P0406FC12C P0406FC3.3C P0406FC08C P0406FC05C P0406 |
FLIP CHIP ARRAY 250 W, BIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE ROHS COMPLIANT, 0406, FLIP CHIP-6
|
List of Unclassifed Manufacturers ETC[ETC] PROTEC[Protek Devices]
|
CM1204 CM1204-03CS CM1204-03CP CM1204-04CP CM1204- |
4-Channel ESD Array in CSP 4-Channel ESD Protection Array in Chip Scale Package with OptiGuard Coating (CSPESD304 pin compatible)
|
California Micro Devices Corporation CALMIRCO[California Micro Devices Corp]
|
VESD05C-FC1 |
Bidirectional ESD protection diodes
in flip-chip 1005 size; Flip Chip Protection Diode - Chip Size 0402
|
Vishay Intertechnology,Inc. VISAY[Vishay Siliconix]
|
TC74HC240AFWI TC74HC241AFI TC74HC244AFI TC74HC244A |
OCTAL BUS BUFFER NON INVERTED, 3-STATE OUTPUTS OCTAL BUS BUFFER INVERTED, 3-STATE OUTPUTS Low Capacitance 8 Line EMI Filter with ESD Protection; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 8 Line EMI Filter with ESD Protection 1.6 x 4.0 mm DFN Package; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 Low Capacitance 8 Line EMI Filter with ESD Protection, 1.6 x 4.0 mm DFN Package ; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000 4 Line EMI Filter with ESD Protection DFN 1.35 x 3.0 mm Package; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000 Low Capacitance 6 Line EMI Filter with ESD Protection; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000 10 Line EMI Filter; Package: Flip-Chip-25 CSP; No of Pins: 25; Container: Tape and Reel; Qty per Container: 3000 TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 东芝的CMOS数字集成电路硅单
|
Toshiba Semiconductor Toshiba Corporation Toshiba, Corp.
|
MM74C74N MM74C74 MM74C74M MM74C74MX |
Dual D Flip-Flop; Package: SOIC; No of Pins: 14; Container: Tape & Reel CMOS SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14 From old datasheet system Dual D-Type Flip-Flop
|
Fairchild Semiconductor, Corp. FAIRCHILD[Fairchild Semiconductor]
|