| PART |
Description |
Maker |
| CYM6001K-25 |
32-BIT, 25 MHz, MICROPROCESSOR, XMA 5.780 X 3.300 INCH, HEAT SINK, SURFACE MOUNT PACKAGE
|
Cypress Semiconductor, Corp.
|
| CP600 CP601 CP604 CP6010 CP602 CP606 CP608 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A/ HEAR-SINK MTG 6A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A , HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A , HEAT-SINK MTG 6A)
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 3A / HEAT-SINK MTG 6A(VOLTAGE 50 to 1000 Volts CURRENT - P.C. MTG 3A / HEAT-SINK MTG 6A)
|
TRSYS
Pan Jit International Inc.
PanJit International Inc.
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ATS-19G-03-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| VHS-45 |
Extruded Heat Sink
|
CUI INC,
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE Electronics, Inc.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| ATS-1104-C1-R0 |
Heat Sink for Half Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
| LPD70130-20B LPD70130-30B LPD70130-15B LPD70130-25 |
Low Pressure Drop Heat Sink
|
ALPHA
|
