| PART |
Description |
Maker |
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| AN483 |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
|
SGS Thomson Microelectronics
|
| MMM-A-134 |
Metal to Metal Structural Bonding
|
ETC
|
| PG240128-A PG240128 |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| SC12N81-1G |
Diamond Bonding and Grounding Hardware
|
List of Unclassifed Man...
|
| MPC555 MPC555LFMZP40 MPC555PB MPC555D MPC555LFAZP4 |
This document provides an overview of the MPC555 microcontroller, including a block diagram showing the major modular components and sections that lis
THIS DOCUMENT PROVIDES AN OVERVIEW OF THE MPC555 MICROCONTROLLER, INCLUDING A BLOCK DIAGRAM SHOWING THE MAJOR MODULAR COMPONENTS AND SECTIONS THAT LIS
This document provides an overview of the MPC555 microcontroller, including a block diagram showing
Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-98
CABLE ASSEMBLY; ; NMO Antenna Mount to BNC Male, RG58C/U, 5 feet
|
MOTOROLA[Motorola, Inc]
Motorola, Inc.
|
| ERJ8GEYJ100V C1206C102K1RACTU 100B470JP500X |
All Gold Bonding Scheme
|
Advanced Semiconductor
|
| TQ5M31K |
BLOCK DIAGRAM
|
TRIQUINT[TriQuint Semiconductor]
|
| MC9RS08KA8CPG MC9RS08KA8CPJ MC9RS08KA8CTG MC9RS08K |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
| STV2160 |
Complete PCB Diagram
|
ST Microelectronics
|
| MC9RS08KB2CSC MC9RS08KB12CSC MC9RS08KB12 MC9RS08KB |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
| MC9RS08LA8 |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
