| PART |
Description |
Maker |
| FD400R12KE3B5 |
62mm C-series module with trench/fieldstop IGBT3 and EmCon High Efficiency series diode
|
eupec GmbH
|
| FF300R12KT3E |
62mm C-series module with common emitter
|
Infineon Technologies AG
|
| FD300R12KS4B5 |
62mm C-series module with the fast IGBT2 for high-frequency switching
|
eupec GmbH
|
| FF400R07KE4 |
62mm C-Series module with trench/fieldstopp IGBT4 and Emitter Controlled Diode
|
Infineon Technologies AG
|
| FF150R12KE3G |
62mm C-series module with the trench/fieldstop IGBT3 and Emcon High Efficiency diode
|
eupec GmbH
|
| FF400R12KE3 |
62mm C-Series module with trench/fieldstopp IGBT3 and EmCon High Efficiency diode
|
Infineon Technologies AG
|
| FF150R17KE4 |
62mm C-Series module with Trench/Feldstopp Trench/Feldstopp IGBT4 and Emitter Controlled Diode
|
Infineon Technologies AG
|
| FF300R06KE3B2 |
62mm C-Serien module with trench/fieldstop IGBT3, EmCon3 diode and M5 power terminals
|
eupec GmbH
|
| TC551001CF-55 TC551001CF-55L TC551001CF-70 TC55100 |
131,072 WORD x 8 BIT STATIC RAM 131072字8位静态RAM
DISPLAY 7SEG 7.62MM 2DGT RED CA
DISPLAY 7SEG 7.62MM 2DGT GRN CA
131072 WORD x 8 BIT STATIC RAM
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| 1MC10-071-10 1MC10-071-15 1MC10-071-20 1MC10071 |
Thermoelectric Module
The MC10 is powered sub-series of large MC series of TE micro-modules. It consists of the following TEC types
|
RMT Ltd.
|
| C67076-A1001-A2 BSM181 C67076-A1016-A2 BSM181R |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:15; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
SIMOPAC Module (Power module Single switch N channel Enhancement mode)
From old datasheet system
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
|
