| PART |
Description |
Maker |
| 01-1392-G8717 03-1392-G8726 03-1392-G8725 01-1392- |
DICHTUNG D FORM 12.7X9.5MM 10M
DICHTUNG RECHTWINKLIG 12.7X6.4MM 10M
DICHTUNG RECHTWINKLIG 6.4X3.3MM 5M
DICHTUNG QUADRATISCH 5.1X5.1MM 10M
DICHTUNG QUADRATISCH 9.5X9.5MM 5M
DICHTUNG D FORM 12.7X9.5MM 5M
DICHTUNG D FORM 9.5X6.4MM 5M
DICHTUNG QUADRATISCH 5.1X5.1MM 5M
DICHTUNG QUADRATISCH 9.5X9.5MM 10M
DICHTUNG D FORM 3.6X2.5MM 10M
DICHTUNG D FORM 9.5X6.4MM 10M
ABSCHIRMSTREIFEN
DICHTUNG RECHTWINKLIG 12.7X6.4MM 5M 诗RECHTWINKLIG 12.7X6.4MM 500
DICHTUNG D FORM 3.6X2.5MM 5M 诗D3.6X2.5MM 500
DICHTUNG RECHTWINKLIG 6.4X3.3MM 10M 诗RECHTWINKLIG 6.4X3.3MM 1000
|
TE Connectivity, Ltd.
Ecliptek, Corp.
|
| PRF80 |
LUEFTER SCHRIMGITTER EMV 80MM
|
|
| 73S1215F-68IMR/F 73S1215F-68IM/F 73S1215F-44IMR/F |
80515 System-on-Chip with USB, ISO 7816 / EMV, PINpad and More
|
Teridian Semiconductor Corporation
|
| 73S1209F-68IM/F 73S1209F-68IMR/F 73S1209F-44IMR/F |
Self-Contained PINpad, Smart Card Reader IC UART to ISO7816 / EMV Bridge IC
|
Teridian Semiconductor Corporation
|
| 73S1209F-68IM_F 73S1209F-68IMR_F |
Self-Contained PINpad, Smart Card Reader IC UART to ISO7816 / EMV Bridge IC
|
Teridian Semiconductor Corporation
|
| 0879437001 87943-7001 |
2.50mm (.098) / 3.50mm (.138) Pitch Wire-to-Board Receptacle Housing with Fuse, 22 Circuits
|
Molex Electronics Ltd.
|
| 87061-0001 0870610001 |
2.50mm (.098) / 3.50mm (.138) Pitch Low Profile Female Crimp Terminal, Tin (Sn) Overall
|
Molex Electronics Ltd.
|
| 22-03-1121 3022-12A 0022031121 |
2.50mm (.098) Pitch Header, Single Row, 7.50mm (.295) Mating Pin Length, 12 Circuits
|
Molex Electronics Ltd.
|
| 22-03-1101 3022-10A 0022031101 AE-3022-10A |
2.50mm (.098) Pitch Header, Single Row, 7.50mm (.295) Mating Pin Length, 10 Circuits
|
Molex Electronics Ltd.
|
| 3022-07A |
2.50mm (.098) Pitch Header, Single Row, 7.50mm (.295) Mating Pin Length, 7 Circuits
|
Molex Electronics Ltd.
|
| 3022-05A 22-03-1051 |
2.50mm (.098) Pitch Header, Single Row, 7.50mm (.295) Mating Pin Length, 5 Circuits
|
Molex Electronics Ltd.
|
