PART |
Description |
Maker |
UPD6P4BMC-5A4 |
MS3112E22-32S
|
NEC Corp.
|
MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0 |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V (32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
|
K4R271669B-NMCG6 K4R441869B-NMCG6 K4R441869B-NMCK7 |
256K x 16/18 bit x 32s banks Direct RDRAMTM
|
http:// SAMSUNG SEMICONDUCTOR CO. LTD.
|
MR18R162468MN1 |
(16Mx16)*4(6/8)pcs RIMMModule based on 256Mb M-die, 32s banks,16K/32ms Ref, 2.5V Serial Presence Detect
|
Samsung Electronic
|
6450130-5 |
MULTI-BEAM XL and MULTI-BEAM XLE - Power Distribution Connector System; MBXL R/A HDR 9P 32S 4P ( AMP )
|
Tyco Electronics
|
6450120-1 |
MULTI-BEAM XL and MULTI-BEAM XLE - Power Distribution Connector System; MBXL R/A HDR 8P 32S 8P ( AMP )
|
Tyco Electronics
|
1450120-1 |
MULTI-BEAM XL and MULTI-BEAM XLE - Power Distribution Connector System; MBXL R/A HDR 8P 32S 8P ( AMP )
|
Tyco Electronics
|
1450120-5 |
MULTI-BEAM XL and MULTI-BEAM XLE - Power Distribution Connector System; MBXL R/A HDR 7P 32S 6P ( AMP )
|
Tyco Electronics
|
6450100-6 |
MULTI-BEAM XL and MULTI-BEAM XLE - Power Distribution Connector System; MBXL VERT HDR 7P 32S 7P ( AMP )
|
Tyco Electronics
|
MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184 TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V 16Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V (MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor]
|