PART |
Description |
Maker |
NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
IC280-720-106 IC280-256-211 IC280-69605.AC-08327 I |
Ball Grid Array (FBGA / CSP / LGA)
|
Yamaichi Electronics Co., Ltd.
|
FBGA-SD |
Fine Pitch Ball Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
FL9B5BH030S-C FL9B5BH060S-C FL7B5BH FL9B5BH033S-C |
Ball-Grid-Array Thin Film Low-Pass Filter
|
ETC List of Unclassifed Manufacturers
|
ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
SM2001 |
I.C. Socket, Pin Grid Array
|
Thomas & Betts
|
546-99-108-12-101-036 546-91-108-12-101-035 546-91 |
Pin Grid Array sockets Press-fit terminations 针栅阵列插座压接端子
|
PRECI-DIP SA PREDIP[Precid-Dip Durtal SA]
|
NP178-64401-1 NP178-64401-1-MF NP178-64401-2 NP178 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
YPKG-C7CG-A7A2DC |
CCGA1272, 37.5 MM X 37.5 MM, 1.0 MM PITCH, 1272 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|