PART |
Description |
Maker |
87874-3001 0878743001 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
87874-3002 0878743002 |
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
|
Molex Electronics Ltd.
|
70287-1001 0702871001 SD-70287-004 |
2.54mm (.100") Pitch C-Grid庐 Header 2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
SD-70287-004 0702871009 |
2.54mm (.100") Pitch C-Grid庐 Header 2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
71764-0110 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header 2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
0022282043 22-28-2043 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating 2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
85013-3093 0850133093 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits 2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits 2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
87911-5411 0879115411 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
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