PART |
Description |
Maker |
MRAC75S MNAC104S MNAC50S MNAC34S MNAC50SJTDH8 MNAC |
COMPSITE OUTLINE ASSY 34 CONTACT(S), FEMALE, MULTIWAY RACK AND PANEL CONN, SOLDER, SOCKET COMPOSITE OUTLINE ASSY
|
Winchester Electronics ... Winchester Electronics Corporation Winchester Electronics Corp...
|
PC1202A PC1202 PC1202LRS-ANH-B |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸 (82.23 k) OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp. Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PG12232-E- PG12232-E-33 |
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸 OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp. Powertip Technology Corp. POWERTIP[Powertip Technology]
|
PG240128-A PG240128 |
OUTLINE DIMENSION & BLOCK DIAGRAM OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp. POWERTIP[Powertip Technology]
|
HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72 CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA 4M x 32 Bit DRAM Module (SO-DIMM) -4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G SIEMENS AG SIEMENS[Siemens Semiconductor Group] Infineon
|
16769 16769-04 |
BOX 3.4X2.56X1.02 W/0 BTNS ALMOND BOX 3.4X2.56X1.02 W/0 BTNS BLK2 OUTLINE DRAWING, HUB470-P OUTLINE DRAWING HUB470-P
|
VICOR[Vicor Corporation]
|
TO-251 |
OUTLINE
|
ETC
|
WDFN2X2-8 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN7X7-44 |
Package Outline
|
Global Mixed-mode Techn...
|
MSOP-10-EP |
Package Outline
|
Global Mixed-mode Techn...
|