| PART |
Description |
Maker |
| 21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|
