| PART |
Description |
Maker |
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| 5962R0622903VYC AT68166FT-YM25-E AT68166FT-YM25-SC |
512K X 32 STANDARD SRAM, 25 ns, CQFP68
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi- Chip Module
|
E2V TECHNOLOGIES PLC
ATMEL Corporation
|
| CYP32G0401DX |
Multi-Gigabit Multi-Mode Quad HOTLINK Transceiver
|
Cypress Semiconductor
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CS201212-5R6K CS201212-4R7K CS201212-R15K CS201212 |
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 5600000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 4700000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 150000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 3300000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 820000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 680000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 180000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 68000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 33000000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns, Inc.
|
| AD5624R AD5644R AD5664R |
Quad,12-Bit <span style="text-transform: lowercase"> <em>nano</span></em>DAC? with 5ppm/°C On-Chip Reference
Quad, 14-Bit nanoDAC? with 5ppm/°C On-Chip Reference
Quad, 16-Bit nanoDAC? with 5ppm/°C On-Chip Reference
|
Analog Devices
|
| TC90A36F |
FIELD DOUBL-SCAN CONVERTER IC FOR A MULTI-STANDARD COLOR TV
FIELD DOUBLE-SCAN CONVERTER IC FOR A MULTI-STANDARD COLOR TV
|
Toshiba Semiconductor
|
| MC14066 MC14066B MC14066BCP MC14066BD MC14066BDR2 |
Replaced by TPS2300 : CompactPCI Hot Swap Power Manager Industrial Temp IC that meets the PICMG Standard 24-TSSOP -40 to 85 QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14
Quad Analog Switch/Quad Multiplexer
|
ONSEMI[ON Semiconductor]
|
| S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc.
SPANSION LLC
|
| M39P0R9080E0ZAD M39P0R9080E0ZADE M39P0R9080E0ZADF |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash Memory 256 Mbit Low Power SDRAM, 1.8V Supply, Multi-Chip Package
|
Numonyx B.V
|
| 12-22SURSYGC 15-22SURSYGC13 |
Chip LED with Bi-Color (Multi-Color)
Technical Data Sheet Chip LED with Bi-Color (Multi Color)
|
Everlight Electronics Co., Ltd
|
| SL5067KG SL5067 SL5067DPAS SL5067MPEF SL5067MPES |
MULTI - STANDARD VIDEO MODULATOR
MULTI ?STANDARD VIDEO MODULATOR
|
General Electric Company
General Electric Compan...
|
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