| PART |
Description |
Maker |
| 3E8 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3B7 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 3C34 |
Material specification
|
Ferroxcube International Holding B.V.
|
| 4A11 |
Material specification
|
Ferroxcube International Holding B.V.
|
| EE16-K-H-10P-SW-AW |
BOBBIN MATERIAL: PHENOLIC PIN MATERIAL: CP WIRE UL REC. UL 94V-0
|
FERYSTER Inductive Components Manufacturer
|
| EF25-K-H-14P-SW |
BOBBIN MATERIAL: PET PIN MATERIAL: CP WIRE UL REC. UL 94V-0
PHOSPHOR BRONZE
|
FERYSTER Inductive Components Manufacturer
FERYSTER Inductive Componen...
|
| K4S641632H-UC60 K4S641632H-UC70 K4S641632H-UC75 K4 |
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
D-Subminiature Connector; Gender:Female; No. of Contacts:50; Contact Termination:IDC; D Sub Shell Size:DB50; Body Material:Steel; Contact Plating:Gold Over Nickel RoHS Compliant: Yes 64芯片与内存规格铅54 TSOP-II免费（符合RoHS
64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free 64芯片与内存规格铅54 TSOP-II免费
DELTA CONN 14POS PLUG W/O INSERT
DELTA CONN 14 POS PLUG BAIL LOCK
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| OPB16450UART |
This document provides the specification
DS433 August 18, 2004 Product Specification
|
Xilinx, Inc.
|
| XC95288XV DS050 XC95288XV-7TQ144I XC95288XV-10CS28 |
High-Performance CPLD
From old datasheet system
Advance Product Specification
D-Subminiature Connector; Gender:Female; No. of Contacts:15; Contact Termination:Through Hole; D Sub Shell Size:DB15; Body Material:Steel; Body Plating:Zinc; Contact Plating:Gold Flash; Mounting Type:Through Hole RoHS Compliant: Yes
D-Subminiature Connector; Gender:Male; No. of Contacts:15; Contact Termination:Crimp; D Sub Shell Size:DB15; Body Material:Steel; Body Plating:Zinc; Contact Plating:Gold RoHS Compliant: Yes
LJT 10C 10#20 PIN PLUG
DSUB 15 M SOD FLOA G
Metal Connector Backshell; Enclosure Material:Steel; Connector Type:Right-Angle; Leaded Process Compatible:No; No. of Positions:25; Peak Reflow Compatible (260 C):No RoHS Compliant: No
DSUB B/S DB 90DEG METAL 1 FLASH PLD, 10 ns, PQFP144
DSUB B/S DB STRT METAL 1 FLASH PLD, 10 ns, PQFP208
Plastic Connector Backshell; Enclosure Material:Steel; Enclosure Color:Yellow; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No FLASH PLD, 10 ns, PQFP208
|
XILINX[Xilinx, Inc]
Xilinx, Inc.
|
| GL5ZV302BOS |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
DEVICE SPECIFICATION FOR Light Emitting Diode
|
Sharp Corporation
Sharp Electrionic Components
|
| MPC7450RXLDPND MPC7450RXLDPNS |
MPC7450 Specification for the XPC7450RXnnnLD Series part number specification pns
Part Number Specification for the XPC7450RXnnnLD Series
Part Number Specification for the XPC7451RXnnnLD Series
|
Motorola
|
