| PART |
Description |
Maker |
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| ZTT-MT-20.000 ZTT-MX-20.000 ZTT-MG-20.000 ZTA ZTA- |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| ILCX09-GI1F18-20.000 ILCX09-HF3F18-20.000 ILCX09-B |
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
|
ILSI America LLC
|
| J68.BPACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| X2-DFN0806-3 SOT89-5 U-DFN3030-14 TSOT25 U-DFN2020 |
SUGGESTED PAD LAYOUT
PACKAGE OUTLINE DIMENSIONS
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| 21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| HC49USM-BB0F18-20.000 HC49USM-BB1F18-20.000 HC49US |
2 Pad Metal Package, 4.7 mm x 13.3 mm
2 Pad Metal Package, 4.7 mm x 13.3 mm
|
ILSI America LLC
|
| 8P4M 8P2M 8P4M-AZ 8P2M-AZ |
12 A, 200 V, SCR, TO-220AB PLASTIC PACKAGE-3
12 A, 400 V, SCR, TO-220AB PLASTIC PACKAGE-3
8 A THYRISTOR
|
Vishay Beyschlag
NEC Corp.
NEC[NEC]
|
