| PART |
Description |
Maker |
| LSSHS-6-D |
.050*.100 cl Dual Row - Straight Low Profile Socket Strips
|
Major League Electronics
|
| BSTS-5-D |
.050*.050 cl Dual Row - Straight Board Stacker Terminal Strips
|
Major League Electronics
|
| 87933-1217 |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 100 Circuits, 0.76μm (30μ) Gold (Au) Plating, Mating Pin Length 3.05mm (0.120), with Cap
|
Molex Electronics Ltd.
|
| TSHR-5-D |
.050x.050 cl Dual Row - Right Angle Terminal Strip Headers
|
Major League Electronics
|
| HFCS10SG HFCS30SG |
.050 IDC CONNECTORS DUAL ROW SOCKETS & TRANSITION PLUGS
|
Adam Technologies, Inc.
|
| TSHSM-5-DV |
.050x.050 cl Dual Row - Surface Mount Terminal Strip Headers
|
Major League Electronics
|
| TBSTCM-5 |
.050x.050 cl Dual Row - Surface Mount Thicker Board Stacker Terminal Strip
|
Major League Electronics
|
| TSHSCM-5-DV |
.050x.050 cl Dual Row - Surface Mount Terminal Strip Headers - Vertical - Custom
|
Major League Electronics
|
| 15444545 1544-45-4545 154445-4545 |
CONNECTOR. VERT. MOUNT , DUAL ROW TOP ENTRY . 100 X . 100 PC
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
