| PART |
Description |
Maker |
| SMSS-5-D-06 |
.050x.050 cl Dual Row Surface Mount Socket Strip
|
Major League Electronics
|
| PTSHS-5-D |
.050x.050 cl Dual Row - Thru Hole Polarized Terminal Strip
|
Major League Electronics
|
| TTSHR-5-D |
.050x.050 cl Dual Row - Right Angle Thicker Terminal Strip Headers
|
Major League Electronics
|
| PSSHSM-5-DV |
.050x.050 cl Dual Row - Surface Mount Polarized Shrouded Socket
|
Major League Electronics
|
| A-70280-0115 0010897720 010-89-7720 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row
|
Molex Electronics Ltd.
|
| 530340-1 |
.050, .075, .100 Box Connectors; 2 ROW BOX RECP 30 POS STAG ( AMP )
|
Tyco Electronics
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0719790407 71979-0407 |
2.54mm (.100) Pitch C-Grid? Receptacle, Surface Mount, Dual Row, Right Angle, 14 Circuits
2.54mm (.100") Pitch C-Grid庐 Receptacle, Surface Mount, Dual Row, Right Angle, 14 Circuits
MOLEX Connector
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
