| PART |
Description |
Maker |
| 00917900X001X06 |
SSL - Discrete Wire IDC
|
AVX Corporation
|
| 009176001032006 009176002022006 009176002022106 00 |
SSL - Discrete Wire IDC
|
AVX Corporation
|
| HI1-0507A2 HI1-0506A5 HI1-0507A5 HI1-0506A2 HI3-05 |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0402-5 90; Contact Mating Area Plating: Tin
Interface IC 接口IC
|
Intersil, Corp.
|
| HI3-0201HS4 HI3-0201HS5 HI1-0201HS2 HI1-0201HS5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0414-4 90; Contact Mating Area Plating: Tin
Interface IC 接口IC
|
Intersil, Corp.
|
| HGT1S7N60A4DS9A |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0692-5 53; Contact Mating Area Plating: Gold 晶体管| IGBT的|正陈| 600V的五（巴西）国际消费电子展|4A一（c）|63AB
|
Intersil, Corp.
|
| 2SJ220 2SJ220L 2SJ220S |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0519-0 01; No. of Positions: 8; Connector Type: Board
SILICON P-CHANNEL MOS FET HIGH SPEED POWER SWITCHING
|
Hitachi,Ltd.
Hitachi Semiconductor
|
| HI1-774J5 HI3-674ALD5 HI3-674ATD/883 HI1-774AK5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0525-5 91; Contact Mating Area Plating: Gold
Converter IC 转换IC
Converter IC 转换器IC
|
Rochester Electronics, LLC
Intersil, Corp.
|
| 280521-2 280522-2 280521-1 280522-1 280377-1 28037 |
Internal Equipment Connection Wire-to-Board for Discrete Wire 2.54mm Centreline
|
Tyco Electronics
|
| AR06-HGW-T-R |
IDC-Socket, 6 Pin, Wire Wrap,
|
Assmann Electronics Inc.
|
| 3647B_36 3647B 3647B/36 |
Round, Shielded/Jacketed, Discrete Wire Cable
|
3M[3M Electronics]
|
| 62300-0700 |
Hawk Discrete Wire Terminator Machine 2.50mm
|
Molex Electronics Ltd.
|
