| PART |
Description |
Maker |
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| S71WS512NB0BAEZZ0 S71WS512NB0BAEZZ2 S71WS512N80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt 堆叠式多芯片产品（MCP）的闪存和移动存储芯片的CMOS 1.8伏特
|
Spansion Inc.
Spansion, Inc.
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品
Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc.
Spansion, Inc.
|
| AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73
Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装（MCP）闪存和SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc.
Advanced Micro Devices
|
| KBY00U00VA-B450 |
MCP Specification
|
Samsung semiconductor
|
| MB84VD22280FE-70 MB84VD22280FA-70 MB84VD22290FE-70 |
2-Stacked MCP
|
Fujitsu
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
| K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|
| WF1M32B-XHX3 WF1M32B-XG2TX3 |
Flash MCP 闪存MCP
|
OKI SEMICONDUCTOR CO., LTD.
|
| WF2M16-XDAX5 WF2M16-XDLX5 WF2M16-XFLX5 |
Flash MCP 闪存MCP
|
Abracon, Corp.
Lumex, Inc.
|
