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HSU88 - Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly

HSU88_7154827.PDF Datasheet

 
Part No. HSU88
Description Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly

File Size 54.11K  /  1 Page  

Maker

TY Semiconductor Co., Ltd



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(CHINA HK & SZ)
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Part: HSU119
Maker: RENESAS
Pack: SOD323
Stock: Reserved
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