| PART |
Description |
Maker |
| ASMT-JB11-NMP01 |
Silicone Encapsulation for LED Advantages and Handling Precautions
|
AVAGO TECHNOLOGIES LIMITED
|
| LTW5AP |
black SMD package, colorless clear silicone resin, silicone lense
|
OSRAM GmbH
|
| LCWCQDP.CC LCW-CQDP.CC |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| LCWCRDP.EC LCW-CRDP.EC |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| LR-CP7P |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| LCWCQ7P.EC LCW-CQ7P.EC |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| D-300-08CS1108 D-300-08CS1108-ND D-300-18 D-300-12 |
CAP, SPLICE ENCAPSULATION
|
PANDUIT CORP.
|
| 303DMQ600 |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| SE5010 |
Silicone Sealant
|
Dow Corning
|
| SPT36-C |
Silicone Photo-Transistor
|
Roithner LaserTechnik G...
|
| KRBTQDLP61.3A |
SMD package with silicone resin
|
OSRAM GmbH
|
