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HSM107S - MPAK package is suitable for high density surface mounting and high speed assembly.

HSM107S_7338113.PDF Datasheet

 
Part No. HSM107S
Description MPAK package is suitable for high density surface mounting and high speed assembly.

File Size 83.41K  /  1 Page  

Maker

TY Semiconductor Co., Ltd



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(CHINA HK & SZ)
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Part: HSM123
Maker: HITACHI
Pack: SOT23
Stock: Reserved
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  100: $0.04
1000: $0.04

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 Full text search : MPAK package is suitable for high density surface mounting and high speed assembly.
 Product Description search : MPAK package is suitable for high density surface mounting and high speed assembly.


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