PART |
Description |
Maker |
CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc. Bourns, Inc.
|
XFEI100505-R12J |
Multi Layer Chip Inductor
|
XFMRS Inc.
|
XFEI100505-8N2J |
Multi Layer Chip Inductor
|
XFMRS Inc.
|
CS321613-R56K CS321613-5R6K CS321613-330K CS321613 |
Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 5.6 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 33 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 6.8 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 0.22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD Ferrite Multi-Layer Chip Inductors 1 ELEMENT, 0.68 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns, Inc. BOURNS INC
|
CE201210-2N2D CE201210-1N8D CE201210-1N5D CE201210 |
Multi-Layer Chip Inductors MAGNETICS MULTILAYER CHIP INDUCTOR
|
Bourns Electronic Solutions Bourns, Inc.
|
CYV15G0403DXB CYP15G0403DXB-BGC CYV15G0403DXB-BGI |
Physical Layer Devices : Video (SMPTE) PHYs Physical Layer Devices : Multi-Protocol PHYs Independent clock quad HOTLink II transceiver. Speed standard.
|
Cypress
|
CTLL2012-FHR22J CTLL2012F-FHR22J CTLL2012-FHR22K C |
Multi-layer Chip Inductors - Ceramic 1 ELEMENT, 0.68 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Central Technologies
|
S3C8478 S3C8475 S3P8475 |
S3C8478/C8475 MICROCONTROLLER S3C8478/C8475 MICROCONTROLLER Multi-Layer SMD Inductor; Series:LG HK; Inductance:3.9nH; Inductance Tolerance: /- 0.3 nH; Q Factor:8; Self Resonant Frequency:7GHz; Package/Case
|
http:// SAMSUNG SEMICONDUCTOR CO. LTD.
|
2506033317H0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
2508051027Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
CL31C332FBFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
500R07S1R3BV4T 252R07S470AV3E 252R03L470AV3E 252R0 |
MULTI-LAYER HIGH-Q CAPACITORS
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Johanson Technology Inc. Johanson Technology Inc...
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