| PART |
Description |
Maker |
| LPD19-6B LPD19-4B LPD19-5B LPD19-3B LPD19-7B LPD19 |
Low Pressure Drop Heat Sink
|
ALPHA
|
| SFM3200-AW |
Low pressure drop
|
List of Unclassifed Man...
|
| 37717-1001 37717-0001 |
CoolFin Heat Sink with Integrated Heat Pipes
|
Molex Electronics Ltd.
|
| RT-375-1/16-X-4FT RNF-100-1/2-5-4FT RNF-100-3/8-5- |
Metal Film Resistor - RN 1/4 T2 590K 1% A
HEAT SHRINK WHT 1.2M
HEAT SHRINK CLR 1.2M 热缩CLR120
HEAT SHRINK BLK 1.2M 热缩120万座
HEAT SHRINK YEL 1.2M 热缩杨氏120
HEAT SHRINK BLU 1.2M 热缩背光120
HEAT SHRINK RED 1.2M 热缩120
HEAT SHRINK GRN 1.2M 热缩GRN 120
HEAT SHRINK CLR 1.2M 热缩CLR20
|
CTS, Corp.
Euroquartz, Ltd.
TE Connectivity, Ltd.
NIC Components, Corp.
|
| ATS-19G-121-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-117-C1-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| VHS-45 |
Extruded Heat Sink
|
CUI INC,
|
| ATS-55190D-C1-R0-17 |
High efficiency cross-cut fin design provides low pressure drop characteristics
|
Advanced Thermal Soluti...
|
| NTE303A |
Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| CP308 CP3010 CP300 CP306 CP304 CP302 CP301 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A 单相硅桥式PC的MTG的甲，热沉MTG3A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A
|
Transys Electronics, Ltd.
TRSYS
|
| XC4028EX-2HQ240C XC4028EX-2HQ304C XC4028EX-2HQ208C |
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP240 HEAT SINK, QFP-240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP304 HEAT SINK, QFP-304
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, PQFP208 HEAT SINK, QFP-208
FPGA, 1296 CLBS, 22000 GATES, 143 MHz, PQFP240
FPGA, 1024 CLBS, 18000 GATES, 166 MHz, CPGA299
FPGA, 1024 CLBS, 15000 GATES, 166 MHz, PQFP304
|
Xilinx, Inc.
XILINX INC
|
| ATS-53250R-C1-R0 |
BGA Heat Sink - High Performance
|
Advanced Thermal Soluti...
|
