| PART |
Description |
Maker |
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| AP2306AGEN-HF AP2306AGEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AK18D300-QSOP AK06D300-QSOP12 AK14D300-QSOP AK20D3 |
Quarter Size Small Outline Package QSOP DIP Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
ACCUTEK MICROCIRCUIT CORPOR...
ACCUTEK MICROCIRCUIT CO...
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| SOT340-1 |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
