| PART |
Description |
Maker |
| C8107 |
3 /C 18 AWG Stranded Tinned Copper, FEP Insulation, Overall Aluminum/Polyester Shield, TC Braid Shield, and FEP Jacket
|
General Cable Technologies Corporation
|
| 74651-1112 |
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Shield Pin End Version, Advanced Mate Shield, 60 Circuits
|
Molex Electronics Ltd.
|
| AN597 |
Implementing Ultrasonic Ranging
|
MICROCHIP[Microchip Technology]
|
| AN86 |
Guidelines for Implementing Low-Cost Ethernet on the Motherboard
|
Cirrus Logic
|
| AND8353D |
Implementing Cost Effective and Robust Power Factor Correction
|
ON Semiconductor
|
| DSP56600 DSP56300 |
Implementing Viterbi Decoders Using the VSL Instruction on DSP Families
|
Freescale Semiconductor, Inc
|
| CS51313-D |
Synchronous CPU Buck Controller Capable of Implementing Multiple Linear Regulators
|
ON Semiconductor
|
| 3CX3000A7 |
Cathode driven RF amplifier
|
Communications & Power Industries, Inc.
|
| 3CX3000F7 |
Cathode driven RF amplifier
|
Communications & Power Industries, Inc.
|
| 3CX1000A7 |
Grid driven RF amplifier
|
Communications & Power Industries, Inc.
|
| 3CX10-000A7 |
Cathode driven RF amplifier
|
Communications & Power Industries, Inc.
|
| 3CW60-000D3 |
Grid driven RF amplifier
|
Communications & Power Industries, Inc.
|
