| PART |
Description |
Maker |
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
| C281P1.5UF20200V C282P1.5UF10200V C285P1.2UF10500V |
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 3333 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.8 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 2825 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.5 uF, SURFACE MOUNT, 5440 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 4040 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, 8.2 uF, SURFACE MOUNT, 11283 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 10000 V, 0.01 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 3000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 2000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 5000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 16080 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 4000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
|
Agilent Technologies, Inc.
Yageo, Corp.
Ecliptek, Corp.
SEMIKRON
Alliance Semiconductor, Corp.
Coilcraft, Inc.
SCHURTER AG
|
| LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
| HKQ0603W11NJ-T |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603U1N8C-TV |
High-Q High Frequency Multilayer Chip Inductors for Automotive / Industrial Applications (HK series Q type)
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04020N8C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W0N8B-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W1N5C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04024N3J-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04020N9C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
Taiyo Yuden (U.S.A.), I...
|
| GMC31Z5U225G25NT GMC43Z5U225G25NT GMC21Z5U225G25NT |
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1812 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1210 CHIP, ROHS COMPLIANT
0.10 UF 80-20% 50V Y5V (0805) CHIP CAP CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.1 uF, SURFACE MOUNT, 0805
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 2.2 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 3.3 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 1 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X7R, 0.0001 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.27 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0000005 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT
1210,47UF,20%,6V3,X5R CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 47 uF, SURFACE MOUNT, 1210
|
Cal-Chip Electronics
AVX, Corp.
|
| HKQ0603W5N1J-T |
High-Q Multilayer Chip Inductors for High Frequency
|
Taiyo Yuden (U.S.A.), I...
|
|
