PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|