PART |
Description |
Maker |
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
LQFP44 |
Package outline
|
Philips
|
WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|