| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| PM2UH1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| 82186 |
Package Dimensions in mm
|
Vishay
|
| PM1SA1 |
PM1SA1 - Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| TSSOP-8PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
|
| 8DIP300 |
8-DIP-300 Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
| HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions
Package Outline Dimensions
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
